SK Hynix annonce la disponibilité de puces DDR4 16 Go, jusqu'à 256 Go de modules DIMM

Sk Hynix has added to its product catalog single-die 16 Gb DDR4 memory chips, which should enable a two-fold increase in maximum memory capacity per single DIMM. This allows SK Hynix to sell same-capacity chips with fewer memory semiconductor dies, due to the increase in storage density, and to increase maximum memory capacity at the same memory die populations as before. The benefits are lower power consumption (due to the reduced number of memory dies to power), and the possibility of putting together either dual-ranked 64 GB modules, quad-ranked 128 GB LRDIMMs and octal-ranked 256 GB LRDIMMs. That last part is the most important: theoretically, the maximum amount of memory on top Intel or AMD server platforms could double, which could enable up to 4 TB RAM in EPYC systems, for example. And as memory-hungry as big data applications have become, there's ever need for higher memory capacity.

Les puces DDR4 de 16 Go de SK Hynix sont organisées en 1Gx16 et 2Gx8 et sont fournies dans les boîtiers FBGA96 et FBGA78, respectivement. Les vitesses de densité actuelles de 16 Go se situent en modes DDR4-2133 CL15 ou DDR4-2400 CL17 à 1,2 V. Les plans de SK Hynix augmenteront les fréquences disponibles au troisième trimestre de cette année, en ajoutant DDR4-2666 CL19 à la gamme. Sources: SK Hynix, via AnandTech